PCB Assembly Services
TDT offers full Turn-Key Circuit Board Assembly Services. We focus on rigid PCB Assembly ,flex PCB assembly and rigid-flex PCB Assembly. Our quality driven PCB assembly process and ERP-MES system ensures that your finished project is of the highest quality. In Full Turn-Key PCBA project, we handle everything including making circuit boards, components sourcing, PCB Assembly , PCBA quality inspection,Housing Part making and final assembly.
How to get a quote for Circuit Board Assembly (PCBA) Services?
1. PCB and BOM Pricing: Send your gerber file and BOM (Bill of Materials) to firstname.lastname@example.org , we will email you the BOM price in 1-2 days. BOM must include the quantities, reference designators, and manufacturer name and manufacturer part number.
2: Please send us the function requirements documents for pcba function test and we charge this part according to labor working time.
3: Please send us the 3D file if need housing part making.
Various testing method will be applied to the assembled boards before the final shipment:
· Visual inspection: general quality check.
· X-ray Inspection: checks for BGAs, QFN and bare circuit boards.
· AOI Testing: checks for solder paste, 0201 components, missing components and polarity.
· ICT (In-Circuit Test).
Functional test (Following your test procedures).
IATF 16949 Certification
TDT's production facilities are IATF16949 certified to ensure we go beyond your expectations.
|PCB Assembly Capacity|
|Type of Assembly||THD (Thru-Hole Device), SMT (Surface-Mount Technology), SMT & THD mixed, Double-sided SMT and THD assembly.|
|Solder Type||Water Soluble Solder Paste, Leaded process and Lead-Free (RoHS)|
|Components||Passives parts, smallest size 01005|
|BGA, uBGA, QFN, POP, and Leadless chips|
|Fine Pitch to 0.8Mils;|
|BGA Repair and Reball; Part Removal and Replacement|
|Connectors and terminals|
|Bare Board Size||Smallest:0.25’’x 0.25’’ (6.35mm x 6.35mm)|
|Largest: 21.02’’ x 20.07’’ (534mm x 510mm)|
|Min. IC Pitch||0.012’’ (0.3mm)|
|QFN Lead Pitch||0.012’’ (0.3mm)|
|Max. BGA size||2.90’’ x 2.90’’ (74mm x 74mm)|
|Min. BGA size||0.012’’ (0.3mm)|
|Type of Service||Turn-key, partial turn-key or consignment|
|AOI (Automated Optical Inspection)|
|ICT (In-Circuit Test)/Functional Testing|
|Turnaround Time||Same day service to 15 days service|
|Component packaging||Reels, cut tape, Tube and tray, Loose parts and bulk|