PCB Manufacturing

PCB Manufacturing

PCB Engineering Capacity
ITEM Standard ADVANCED
MAX Layer Count 16 24
MAX Board Size  530 ×610mm 2000 ×610mm
MAX Board Thickness 6mm 10mm
Min Board Thickness 0.25mm( 2 layer )
0.40mm(4 layer )
0.20mm(2 layer)
0.38mm(4 layer)
Max Surface Cu Thickness 6OZ  12OZ
Line Width/Spacing 0.075mm/0.075mm 0.075mm/0.065mm
Min S/M Bridge 0.10mm 0.075mm
Min PTH Hole Size 0.20mm 0.15mm
Min Microvia Hole Size 0.10mm 0.10mm
Outline Tolerance  ±0.125mm  ±0.10mm
Min PTH PAD Size 0.45mm 0.40mm
PTH Aspect Ratio 8:01 10:01
Drill Position Accuracy  ±0.05mm  ±0.05mm
Impedance Control Single-
ended/Differential
±10% ±8%
Bow and Twist  0.75% 0.50%
Materials FR4/Halogen free/Teflon/
Rogers/Aluminum/Hybird
Surface Finishing ENIG/OSP/Gold Plating(Soft/hard)
/HASL/Imm. Silver/IMM.Tin/Tin
Plating/Carbon Ink/Selective
/Imm.metal+OSP
Sample PCB Producing  Leadtime
PCB Layer                                                     Leadtime  Lead Time (Working days,ex-factory)
Urgent (hour) Normal (day) 
1 、2L 12 4--5
4L  36 5--7
6 、8L 72 7--9
10 L and up  To be determined based on gerber file 
The above lead time is based on: 1.Matrial Available
2.All Engineering issues comfirmed
 PCB Mass Producing  Leadtime
     PCB Layer                                                  Leadtime  Lead Time (Working days,ex-factory)
Urgent (day) Normal (day) 
1 、2L 3--7 8--10
4L  7--9  12--14
6 、8L 12--14 15--18
10 L and up  To be determined based on gerber file 
The above lead time is based on: 1.Matrial Available
2.All Engineering issues comfirmed