Rigid PCB Assembly

We are equipped with the state-of-the-art manufacturing facility and sophisticated machinery to support the fabrication. We also have highly trained and experienced personnel to make sure your project is done faster with high quality.

Type of PCB Assembly:THD (Thru-Hole Device), SMT (Surface-Mount Technology), SMT & THD mixed, Double-sided SMT and THD assembly. Flexible pcb assembly , rigid pcb assembly ,flexible-rigid pcb assembly
Solder Type:Water Soluble Solder Paste,  Lead-Free (RoHS, Reach)
Components package:Passives parts, smallest size 01005
BGA, uBGA, QFN, POP, and Leadless chips
Fine Pitch to 0.8Mils;
BGA Repair and Reball; Part Removal and Replacement
Connectors and terminals
Min. IC Pitch:0.012’’ (0.3mm)
QFN Lead Pitch:0.012’’ (0.3mm)
Min. BGA size:0.012’’ (0.3mm)
MOQ:No MOQ requirement
Flexible PCB Assembly
  Attributes details
Type of PCB Assembly:SMT
Solder Type:Water Soluble Solder Paste,  Lead-Free (RoHS, Reach)
Components package:Passives parts, smallest size 01005
BGA, uBGA, QFN, POP, and Leadless chips
Fine Pitch to 0.8Mils;
BGA Repair and Reball; Part Removal and Replacement
Connectors and terminals
Min. IC Pitch:0.012’’ (0.3mm)
QFN Lead Pitch:0.012’’ (0.3mm)
Min. BGA size:0.012’’ (0.3mm)
MOQ:No MOQ requirement
Rigid-flexible PCB Assembly
  Attributes details
Type of PCB Assembly:THD (Thru-Hole Device), SMT (Surface-Mount Technology), SMT & THD mixed, Double-sided SMT and THD assembly. Flexible pcb assembly , rigid pcb assembly ,flexible-rigid pcb assembly 
Solder Type:Water Soluble Solder Paste,  Lead-Free (RoHS, Reach)
Components package:Passives parts, smallest size 01005
BGA, uBGA, QFN, POP, and Leadless chips
Fine Pitch to 0.8Mils;
BGA Repair and Reball; Part Removal and Replacement
Connectors and terminals
Min. IC Pitch:0.012’’ (0.3mm)
QFN Lead Pitch:0.012’’ (0.3mm)
Min. BGA size:0.012’’ (0.3mm)
MOQ:No MOQ requirement