Rigid PCB Assembly | |
We are equipped with the state-of-the-art manufacturing facility and sophisticated machinery to support the fabrication. We also have highly trained and experienced personnel to make sure your project is done faster with high quality. | |
Type of PCB Assembly: | THD (Thru-Hole Device), SMT (Surface-Mount Technology), SMT & THD mixed, Double-sided SMT and THD assembly. Flexible pcb assembly , rigid pcb assembly ,flexible-rigid pcb assembly |
Solder Type: | Water Soluble Solder Paste, Lead-Free (RoHS, Reach) |
Components package: | Passives parts, smallest size 01005 BGA, uBGA, QFN, POP, and Leadless chips Fine Pitch to 0.8Mils; BGA Repair and Reball; Part Removal and Replacement Connectors and terminals |
Min. IC Pitch: | 0.012’’ (0.3mm) |
QFN Lead Pitch: | 0.012’’ (0.3mm) |
Min. BGA size: | 0.012’’ (0.3mm) |
MOQ: | No MOQ requirement |
Flexible PCB Assembly | |
Attributes details | |
Type of PCB Assembly: | SMT |
Solder Type: | Water Soluble Solder Paste, Lead-Free (RoHS, Reach) |
Components package: | Passives parts, smallest size 01005 BGA, uBGA, QFN, POP, and Leadless chips Fine Pitch to 0.8Mils; BGA Repair and Reball; Part Removal and Replacement Connectors and terminals |
Min. IC Pitch: | 0.012’’ (0.3mm) |
QFN Lead Pitch: | 0.012’’ (0.3mm) |
Min. BGA size: | 0.012’’ (0.3mm) |
MOQ: | No MOQ requirement |
Rigid-flexible PCB Assembly | |
Attributes details | |
Type of PCB Assembly: | THD (Thru-Hole Device), SMT (Surface-Mount Technology), SMT & THD mixed, Double-sided SMT and THD assembly. Flexible pcb assembly , rigid pcb assembly ,flexible-rigid pcb assembly |
Solder Type: | Water Soluble Solder Paste, Lead-Free (RoHS, Reach) |
Components package: | Passives parts, smallest size 01005 BGA, uBGA, QFN, POP, and Leadless chips Fine Pitch to 0.8Mils; BGA Repair and Reball; Part Removal and Replacement Connectors and terminals |
Min. IC Pitch: | 0.012’’ (0.3mm) |
QFN Lead Pitch: | 0.012’’ (0.3mm) |
Min. BGA size: | 0.012’’ (0.3mm) |
MOQ: | No MOQ requirement |