High Tg PCB

High Tg PCB

The Glass Transition Temperature (Tg) is one of the most important properties of any epoxy and is the temperature region where the polymer transitions from hard, glassy material to a soft, rubbery material.

Circuit board material must flame-resistant, it can’t be burned at a certain temperature and only be softened. The temperature point is called the glass transition temperature (Tg).

The higher Tg point means a higher temperature requirement during lamination. And the boards will be hard and crisp, which will affect the hole and the electrical properties.

Ordinary PCB materials at high temperatures, not only will be softened, deformation, melting and other phenomena, but also the mechanical and electrical properties decline sharply.

General FR4 Tg is 130-140 centigrade, moderate Tg is greater than 150-160 centigrade, High-Tg is greater than 170 degrees.

The higher of Tg, the better the performance of PCB heat resistance, moisture resistance, chemical resistance, stability and other characteristics.

PCB circuit board Files format:

Gerber, .pcb, .pcbdoc or .cam

Printed circuit board Materical:

Shengyi S1000-2, ISOLA 370HR, ITEQ-IT 180L TG170

PCB board Surface Finishing:

ENIG/OSP/Gold Plating(Soft/hard)

/HASL/Imm. Silver/IMM.Tin/Tin

Plating/Carbon Ink/Selective

/Imm.metal+OSP

PCB board Cooper Thickness:

0.5OZ-12OZ

Printed circuit board Layer:

1-24 Layer

Printed circuit board thickness:

0.25mm -10mm

Min PCB  Line Width/Spacing:

0.075mm/0.065mm

PCB board  Min S/M Bridge:

0.075mm

Min PCB PTH Hole Size:

0.15mm

Min PCB Microvia Hole Size:

0.1mm

PCB board Outline Tolerance :

 ±0.10mm

PCB PTH Aspect Ratio :

10/0.1

Impedance Control Single-ended/Differential:

±10%

PCB board Bow and Twist :

0.75%